EC ENGR X 457.56 - Power Integrity and Noise Coupling in Integrated Circuits
Course Description
This course covers the analysis and design of integrated circuits power delivery networks focusing on power integrity and noise coupling in chip, package and printed circuit board (PCB) structures. Topics include power delivery impedance in chip/package/PCB co-design, loop inductance, effective decoupling capacitors techniques, power delivery impedance variation with frequency and resonance peaks, noise generation in chip substrate and power delivery networks, noise propagation in various types of substrated and fabrication technologies, noise reception in sensitive circuits, noise coupling suppression techniques, and power integrity and noise coupling modeling and simulation. The learning approach balances qualitative and quantitative analysis methods with practical intuitive techniques for understanding the physical phenomena. Students are exposed to various practical examples and are guided to complete a design project in which they develop the power delivery network and simulate the power integrity and noise coupling effects in a chip/package/PCB integrated circuit structure.
Course Outline
This course covers the analysis and design of integrated circuits power delivery networks focusing on power integrity and noise coupling in chip, package, and printed circuit board (PCB) structures.
Notes
Contact:Department of Engineering & Technology
(310) 825-4100
et@uclaextension.edu
Applies Towards the Following Certificates
- Integrated Circuit Design : Electives
- Study Abroad at UCLA Program : Required
